Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6S Plus
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- TVC-661600112A
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Description
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6S Plus
Imported alloy steel, high-temperature resistant and wear-resistant
Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing
Compatible with:
iPhone 6S/6S Plus