Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 11/11 Pro/11 Pro Max
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- TVC-661600096A
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Description
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 11/11 Pro/11 Pro Max
Imported alloy steel, high-temperature resistant and wear-resistant
Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing