1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.65mm

• Brand new and high quality

• Solder tin paste is the best choice of reballing IC 

• It is used instead of the pin in the IC component package structure

Specification:

• Brand: BEST

• Model: 505

• Material: tin

• Diameter: 0.2mm~0.65mm 
  

• Flux content: 63%

• Melting point: 183°C

• Working temperature: 200-380°C

• Quantity: 25,000pcs per bottle

• Balls alloy: Sn63/Pb37

• Size: 35x16mm