JP-19 Thermostatic Soldering Platform for iPhone X / XS / XS Max Motherboard layering Upper Lower Separation Glue Remove, US Plug
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- SKU:
- ETP1120
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Description
1. Support 110V/220V two kinds of voltage, the temperature is 200 degree centigrade.
2. Constant high temperature, porous heat dissipation, one-key separation.
3. Double step positioning, safe disassembly, detachable and weldable.
4. Positioning degumming tank, all kinds of chips easy degumming.
5. Silica gel is completely surrounded, anti-slip and heat-resistant to prevent current leakage.
6. High purity copper plate, extension design, professional welding tools.
7. High precision CNC machining, heat evenly without damage to the motherboard.
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2. Constant high temperature, porous heat dissipation, one-key separation.
3. Double step positioning, safe disassembly, detachable and weldable.
4. Positioning degumming tank, all kinds of chips easy degumming.
5. Silica gel is completely surrounded, anti-slip and heat-resistant to prevent current leakage.
6. High purity copper plate, extension design, professional welding tools.
7. High precision CNC machining, heat evenly without damage to the motherboard.